{"ok":true,"entity":{"id":"advanced-packaging","name":"Advanced Packaging","entityType":"concept","officialName":"Advanced Packaging（先端パッケージング）","canonicalName":"Advanced Packaging","displayName":"Advanced Packaging","category":"半導体実装技術（2.5D/3D・ヘテロジニアス集積）","shortDescription":"先端パッケージングは、複数のチップ（チップレットやメモリ）を2.5D・3D積層やファンアウトなどの手法で一つのパッケージに高密度に統合する半導体実装技術の総称です。TSMCは3DFabric（SoIC、CoWoS、InFO）を提供し、ASEは2026年の設備投資を過去最高の105億米ドルに引き上げたと報じられています（2026年7月時点）。","primaryCluster":"semiconductors","parentEntity":null,"verificationStatus":"draft","website":"https://www.tsmc.com/english/dedicatedFoundry/services/advanced-packaging","updatedAt":"2026-10-08T04:59:44.910Z","secondaryClusters":[],"alias":["先端パッケージング","先進パッケージ","高度パッケージング"],"searchKeywords":["先端パッケージング","advanced packaging","2.5D","3D積層","CoWoS","ヘテロジニアス集積","ファンアウト","半導体後工程"]},"referenceIndex":["P-01-001","P-02-001","P-04-001","P-05-001","P-06-001"]}